Overall size: 58*58*16mm(length * width * height).
Support platform: Intel the LGA / 1150/1151/1155/1156/2011/2011-775/1366 v3, AMD SocketFM1 / FM2 / FM2 + / AM2 / AM2 + / AM3 AM3 + / AM4 (part of the platform need to change or fixture screw).
It is recommended to use the special heat conduction fluid of Syscooling brand.
The base is made of pure copper to ensure the heat conduction efficiency.
There are up to 30 tiny channels inside, which increase the contact area of liquid and take away heat more quickly.
Imported PMMA material cover, high permeability and high strength.
The nozzle design is standard g1/4 thread, convenient for quick twist or pagoda head.
High quality sealing process, factory through 3 air tightness detection, safety and leakage prevention, more reliable.